Motorola Solutions Foundation Engineering Pathways Scholarship (Deadline: December 4, 2017)
Who Can Apply: Scholarship for Spring of 2018. Engineering – Awarded to students that their first semester is Fall of 2017, who are enrolled in Harper College’s Engineering Program full-time. Students should have a cumulative GPA of 3.5 or higher and must be admitted to the University of Illinois at Urbana-Champaign’s Engineering Pathways program. In addition, students are asked to submit up to three letters of recommendation.
Submission: Please describe the extracurricular activites, service learning or community volunteer opportunities in which you are or have been involved.
Deadline: December 4, 2017